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Different glass laser marking technologies

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2018/03/28 09:55
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[Abstract]:
AnewtechnologymakesitpossibletouseencapsulatedCO2laserstoproducesharpandhigh-qualitysignsdirectlyonglass.Thisisatechnologythatcanreplaceexpensivesolid-statelasersandtraditionalglassmarkingmethods(25WC
A new technology makes it possible to use encapsulated CO2 lasers to produce sharp and high-quality signs directly on glass. This is a technology that can replace expensive solid-state lasers and traditional glass marking methods (25W CO2 lasers Satisfy most requests for marking on glass). The CO2 laser marks the glass by destroying the appearance of the glass. Therefore, it is permissible to exhibit a certain amount of cracks on the glass. However, excessive cracks can lead to unclear marks and potentially weakened data intensity. The more serious is that the substrate becomes loose. Accurately controlling the amount of data cracks during the marking process will prevent these problems.
 
Modern new technology makes it possible to use enveloped CO2 lasers to create sharp, high-quality markings directly on glass. This is a technology that can replace expensive solid-state lasers and conventional glass laser marking (25W CO2 lasers). Can meet most of the requirements in the glass marking machine). CO2 lasers mark glass by breaking the glass surface, so that a certain amount of cracks on the glass is allowed, but excessive cracks can result in unclear marks, potentially weakened material strength, and more seriously, the substrate becomes loose. Accurately controlling the amount of cracking in the marking process can avoid these problems.
 
The first method is to use repeated laser radiation; the second method is to use a discrete point to form a ring crack; the third method is to produce a crack-like appearance of cracks. Using a single laser radiation produces a sharply visible mark on the glass, but the direction of the cracks and stress pattern will extend perpendicular to the direction of laser movement. After a short time or a few days after the logo is printed, these cracks perpendicular to the moving direction of the laser will constitute new cracks, extending to the left and right areas outside the original mark to form fragments, which will affect the clarity of the mark. Repeated laser radiation is applied to heat the area adjacent to the marking area through heat conduction so that these areas form a stress gradient and reduce the possibility of secondary breakage. Using this method to mark on soda-lime glass and borosilicate glass is very effective. One laser radiation is more effective for marking on fused silica glass and quartz glass because the shrinkage coefficient of these two kinds of data is very low.
 
The second approach is to use a series of ring cracks to form text, bar codes, square or rectangular codes, and other shape codes. The glass undergoes heating and cooling cycles to produce a low density annular crack. When the glass is heated, it shrinks and compresses the surrounding data. When the temperature rises to the softening temperature of the glass, the glass quickly shrinks to form a dome with a low-density data of the protruding glass. After heating, the glass shrinks to its initial appearance, but this relaxation time is just the time taken for the entire low density to make it unable to return to the initial position before the softening temperature.
 
Three different marking methods were used to mark the glass with a CO2 laser, that is, multiple laser passes; the discrete points constituted a ring-shaped crack and a crack-like appearance crack.
 
Because the spot energy is Gaussian, the temperature at the center of the spot is high. When this high temperature zone returns to near the initial position, the center of the annular crack is formed in this zone. A stable annular crack is formed at the junction between the low-density formation region and the normal density region. This method is suitable for marking on ordinary optical data and tempered glass, chemically strengthened glass or ordinary soda-lime float glass.
 
The third approach is to use the same heating and cooling process, both to make a change in the appearance of a particular volume of glass. However, the size of the light spot used in the third method is relatively large, and the boundary between the two density regions is not as clear as the circular crack method. The mark produced by this method is not immediately visible, and a slight pressure is applied before a crack starts to form along the laser marking area. The resulting textless, cracked fringe pattern fills the text, graphics, and various codes. Since this method requires a pure appearance, a clear sign can be printed with high-quality automotive glass.
 
Two glass laser marking machines are recommended below:
 
Semiconductor-pumped laser marking machine adopts the most advanced semiconductor pumped laser technology. The high electro-optical conversion efficiency, high peak power, small size, and low consumption represent the future direction of laser equipment development.
 
The machine's key components are all imported, ensuring extremely high marking accuracy and speed, extremely stable performance, and continuous operation for a long time. Compared with the traditional lamp-pumped YAG marking machine, the work materials that can be adapted are more extensive and easier to match with various production lines to achieve online marking.
 
Marker software runs on the WINDOWS platform, Chinese interface, compatible with AUTOCAD, CORELDRAW, PHOTOSHOP and other software file formats, such as PLT, PCW, DXF, BMP, etc., but also can directly use the SHX, TTF font.
 
Application scope:
 
This series of marking machine can be used for high-speed engraving of fine text patterns on metal and various non-metal materials. It is widely used in marking work such as barcodes, two-dimensional codes, graphics, text, codes, serial numbers, batch numbers, dates, etc. Industry, such as hardware tools, knives, locks, cutlery, electrical appliances, glasses, lighters, sanitary ware, buttons, gold and silver jewelry, ceramics, rubber, electronic products, telecommunications products, auto parts and so on.
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